Plastics are widely used in the field of electric and electronic components by taking advantage of the characteristics of
the light weight, acid resistance, shape design flexibility, etc. In general, plastic materials have excellent heat insulation
and electrical insulation, but they have a disadvantage that the heat conductivity is as low as approx. 0.1-0.3 W/mK.

As downsizing and high integration of electric and electronic components such as semiconductor devices,
ICs, LSIs, etc. are progressing in recent years, there have been cases where restrictions arise on product design
because heat generated in the inside of devices and accumulated in plastic parts cannot be released to outside.

As such, measures against heat generation such as how fast to remove heat generated from a circuit is an extremely
important problem to be solved, and fillers which have both electrical insulation and high heat conductivity are required.
As insulating heat-conductive fillers, Silicon oxide SiO and Aluminum oxide Al203 are generally used, and further,
Magnesium oxide MgO, Boron nitride BN, Aluminum nitride AlN, etc. which have higher heat conductivity are considered,
however, they all have disadvantages as shown in the table below and they have not used yet for general purposes.

We are the first company who has succeeded in synthesizing pure anhydrous Magnesium carbonate (Magnesite),
Magnesium oxide with improved water resistance, and Magnesium hydroxide with improved acid resistance. As all these
fillers are highly safe to a human body, suppliable at low cost and have excellent general versatility, application of the
fillers to high heat conductivity fillers can be expected.